Electronic structures including barrier layers defining lips

Details Electronic structures including barrier layers defining lips Electronic structures including barrier layers defining lips

2008-08-20

2010-11-16

Nguyen, Khiem D (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257SE21508, C257SE23021, C438S612000, C438S613000

Reexamination Certificate

active

07834454

ABSTRACT:
Forming an electronic structure may include forming a seed layer on a substrate, and forming a mask on the seed layer. The mask may include an aperture therein exposing a portion of the seed layer, and a barrier layer may be formed on the exposed portion of the seed layer. A bump may be formed on the barrier layer, and the mask may be removed. In addition, portions of the seed layer may be selectively removed using the barrier layer as an etch mask.

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