Fine pitch low-cost flip chip substrate

Details Fine pitch low-cost flip chip substrate Fine pitch low-cost flip chip substrate

2006-06-06

2006-06-06

Smith, Matthew (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S779000

Reexamination Certificate

active

07057284

ABSTRACT:
A package is disclosed, which includes a substrate, a solder masker, and a first aperture through the solder mask. The substrate has a surface on which metal traces are formed. The solder mask covers at least a portion of the surface of the substrate. And the first aperture through the solder mask exposes a plurality of the metal traces.

REFERENCES:
patent: 6389689 (2002-05-01), Heo
patent: 6431432 (2002-08-01), McCormick et al.
patent: 6622380 (2003-09-01), Grigg
patent: 2003/0209807 (2003-11-01), Hosomi

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