IC chip mounting method

Details IC chip mounting method IC chip mounting method

2007-05-08

2007-05-08

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE23001

Reexamination Certificate

active

11319652

ABSTRACT:
An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.

REFERENCES:
patent: 6531337 (2003-03-01), Akram et al.
patent: 6531338 (2003-03-01), Akram et al.
patent: 6897096 (2005-05-01), Cobbley et al.
patent: 2004/0115866 (2004-06-01), Bang et al.
patent: 2005/0041402 (2005-02-01), Cady et al.
patent: 2006/0084254 (2006-04-01), Attarwala
patent: 11-219962 (1999-08-01), None
patent: 2003-242472 (2003-08-01), None
patent: WO 02/091812 (2002-11-01), None
European Search Report mailed Dec. 4, 2006 (4 pages).

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