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Highly reliable, cost effective and thermally enhanced AuSn...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Highly selective and complete interconnect metal line and...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Highly selective chemical dry etching of silicon nitride over si

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Highly selective dry etching process

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Highly selective etch process for submicron contacts

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Highly selective liners for semiconductor fabrication

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Highly selective nitride etching employing surface mediated...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Highly selective oxide etch process using hexafluorobutadiene

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Highly selective silicon oxide etching compositions

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Highly uniform group III nitride epitaxial layers on 100...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate
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Highly-selective metal etchants

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
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Hillock inhibiting method for forming a passivated copper...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Hillock reduction in copper films

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Hillock reduction in copper films

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Holding jig, semiconductor wafer grinding method,...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Hole metal-filling method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Hole pattern forming method and semiconductor device...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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Hole-filling technique using CVD aluminum and PVD aluminum...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Holey electrode grids for photovoltaic cells with...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
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Hollow chip package and method of manufacture

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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