Highly reliable, cost effective and thermally enhanced AuSn...

Details Highly reliable, cost effective and thermally enhanced AuSn... Highly reliable, cost effective and thermally enhanced AuSn...

2006-09-08

2009-10-27

Le, Thao X (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257S707000, C257SE33075

Reexamination Certificate

active

07608485

ABSTRACT:
In a circuit, an integrated circuit package and methods for attaching integrated circuit dies or discrete power components to flanges of integrated circuit packages, each of the integrated circuit dies is sawed from a wafer. The thickness of the wafer is reduced by mechanical grinding, applying an isotropic wet chemical etching to the wafer to eliminate crystal defects, evaporating adhesion and diffusion barrier metals on the backside of the wafer, evaporating Au and Sn on the backside of the wafer, wherein the weight proportion of Au is equal to or larger than 85%, sawing the wafer into the circuit dies, and soldering each of the circuit dies to a respective flange of an integrated circuit package.

REFERENCES:
patent: 3648357 (1972-03-01), Green, Jr.
patent: 4360965 (1982-11-01), Fujiwara
patent: 4518112 (1985-05-01), Miller et al.
patent: 4875617 (1989-10-01), Citowsky
patent: 5353193 (1994-10-01), Chia et al.
patent: 5384690 (1995-01-01), Davis et al.
patent: 6027957 (2000-02-01), Merritt et al.
patent: 6123865 (2000-09-01), Lin et al.
patent: 2001/0000416 (2001-04-01), Uzoh
patent: 2003/0045066 (2003-03-01), Igarashi
patent: 2004/0029304 (2004-02-01), Naydenkov et al.
patent: 2004/0227229 (2004-11-01), Hu et al.
patent: 4025622 (1992-02-01), None
patent: 2221570 (1990-02-01), None
patent: 2300375 (1996-11-01), None
patent: 61056422 (1986-03-01), None

Affiliated with

Also associated with

Rating

Highly reliable, cost effective and thermally enhanced AuSn... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Highly reliable, cost effective and thermally enhanced AuSn..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Highly reliable, cost effective and thermally enhanced AuSn... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4088934