Holding jig, semiconductor wafer grinding method,...

Details Holding jig, semiconductor wafer grinding method,... Holding jig, semiconductor wafer grinding method,...

2011-01-25

2011-01-25

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S106000, C438S460000, C257SE21235, C257SE21237, C257SE21238, C257SE21260, C257SE21261, C257SE21264, C257SE21267, C257SE21329

Reexamination Certificate

active

07875501

ABSTRACT:
A backgrinding machine10of a semiconductor wafer W includes: a table13set on the working plane of a mount11; a multiple number of holding jigs20arranged via check tables15on table13; a grinding machine30for performing a grinding process of the rear side of semiconductor wafer W held by holding jig20; and a washing device40for ground semiconductor wafers W. Each holding jig20is constructed of a concave22depressed on the surface of a base plate21, a multiple number of supporting projections23projectively arrayed on the bottom surface of concave22, a deformable contact film24, covering the concave22, being supported by the multiple supporting projections23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path25for conducting air from the concave22covered by contact film24to the outside.

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Notification of Transmittal of Translation of the International Preliminary Report on Patentability (Form PCT/IB/338), International Preliminary Report on Patentability (Form PCT/IB/373), Written Opinion of the International Search Authority (Form PCT/ISA/237) mailed in corresponding International Patent Application No. PCT/JP2007/054628, Sep. 25, 2008, The International Bureau of WIPO, Geneva, CH.
PCT/ISA/210 (International Search Report).

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