Hollow chip package and method of manufacture

Details Hollow chip package and method of manufacture Hollow chip package and method of manufacture

1992-11-18

1999-03-23

Brown, Peter Toby

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438 15, 438123, H01L 23367

Patent

active

058858539

ABSTRACT:
Semiconductor package and method in which a chip is mounted in an opening in a frame with the back side of the chip facing outside the package, and a heatsink is positioned in direct thermal contact with the back side of the chip. In one preferred method of manufacture, the chip is mounted in the frame and tested before the heatsink is attached.

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