S.sub.i O.sub.2 wire bond insulation in semiconductor assemblies

Sample preparation apparatus and method

Saw and etch singulation method for a chip package

Saw-singulated leadless plastic chip carrier

Scalable transfer-join bonding lock-and-key structures

Schottky diode device with aluminum pickup of backside cathode

Seal ring structure for radio frequency integrated circuits

Sealed three dimensional metal bonded integrated circuits

Sealing apparatus for semiconductor wafer and method of...

Secure digital memory card using land grid array structure

Secure package with anti-tamper peripheral guard ring

Securing an optical component onto a micro bench

Selectively-etched nanochannel electrophoretic and...

Self locking and aligning clip structure for semiconductor...

Self-adjusting semiconductor package stand-offs

Self-aligned connector for stacked chip module

Self-aligned electrodes contained within the trenches of an...

Self-assembly of micro-structures

Self-location method and apparatus

Semi-finished package and method for making a package