Secure package with anti-tamper peripheral guard ring

Details Secure package with anti-tamper peripheral guard ring Secure package with anti-tamper peripheral guard ring

2007-08-31

2009-11-10

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257S688000

Reexamination Certificate

active

07615416

ABSTRACT:
A ball grid array (BGA) package (such as one BGA package of a package-on-package (POP) secure module assembly) includes a substrate, and integrated circuit, and array of bond balls. The BGA package further includes a first amount of encapsulant that covers the integrated circuit and a novel second amount of encapsulant. The novel second amount of encapsulant is a peripheral strip that extends along an edge of the substrate to form a peripheral guard ring. The peripheral guard ring provides an additional amount of anti-tamper security to the BGA package. The guard ring can be fabricated with no or very little additional cost if the guard ring is formed in the same encapsulation step employed to encapsulate the integrated circuit. In some embodiments, the peripheral guard ring is made part of and/or is coupled to anti-tamper circuitry such that if the guard ring is disturbed a tamper condition is detected.

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Web pages from www.amkor.com, 18 pages (downloaded and printed out Apr. 30, 2007).

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