Scalable transfer-join bonding lock-and-key structures

Details Scalable transfer-join bonding lock-and-key structures Scalable transfer-join bonding lock-and-key structures

2010-05-14

2011-12-13

Garber, Charles (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S741000

Reexamination Certificate

active

08076177

ABSTRACT:
Scalable transfer-join bonding techniques are provided. In one aspect, a transfer-join bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one metal pad embedded in an insulator and at least one via in the insulator over the metal pad. The via has tapered sidewalls. A second bonding structure is provided having at least one copper stud adapted to have a taper that complements the tapered sidewalls of the via, such that the via and the copper stud fit together like a lock-and-key. The first bonding structure is bonded to the second bonding structure by way of a metal-to-metal bonding between the metal pad and the copper stud that deforms the copper stud. A transfer-join bonded structure is also provided.

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Andreas Munding, “Interconnect Technology for Three-Dimensional Chip Integration,” Dissertation Ulm University (2007).

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