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B-stageable die attach adhesives

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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B-stageable underfill encapsulant and method for its...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Back-side through-hole interconnection of a die to a substrate

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Back-to-back semiconductor device module, assemblies...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Backgrinding-underfill film, method of forming the same,...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Backside encapsulation of tape automated bonding device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Backside failure analysis capable integrated circuit packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Backside failure analysis for BGA package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Backside metallization on microelectronic dice having...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Backside metallization on microelectronic dice having...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Backside metallization on sides of microelectronic dice for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Balance filter packaging chip having balun mounted therein...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Balance filter packaging chip having balun mounted therein...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Ball grid array (BGA) encapsulation mold

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent

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Ball grid array (BGA) encapsulation mold

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Ball grid array interposer, packages and methods

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Ball grid array module

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Ball grid array package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Ball grid array package and fabrication method therefor

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Ball grid array package and process for manufacturing same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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