Self-location method and apparatus

Details Self-location method and apparatus Self-location method and apparatus

2006-09-12

2006-09-12

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S455000, C438S800000

Reexamination Certificate

active

07105376

ABSTRACT:
A method and apparatus for transporting and dispersing microstructures on a substrate by fluidic self-assembly. The apparatus has an assembly vessel that is tilted and rotated to apply uncaptured microstructures back onto the substrate as the assembly vessel rotates. The assembly vessel has ramp structures that collect the microstructures that have not been captured by the substrate at the lower edge of the assembly vessel, carry the microstructures as the assembly vessel rotates, and release the microstructures back on to the substrate at the upper edge of the assembly vessel. Vibrational energy may also be applied to the assembly vessel to assist in the dispersal and location of the microstructures on the substrate.

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