Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-03-27
2007-03-27
Kebede, Brook (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S109000, C257S676000, C257S777000, C257S778000
Reexamination Certificate
active
11087913
ABSTRACT:
An integrated circuit package includes a semiconductor chip having a passivation layer forming the top surface of the semiconductor chip and a metal pad formed on the passivation layer and a discrete electronic device having a first terminal formed on a first surface and a second terminal formed on a second surface opposite the first surface of the discrete electronic device where the first surface of the discrete electronic device is attached to the metal pad using a conductive adhesive structure. The semiconductor chip and the discrete electronic device are encapsulated in an encapsulation material. An electrical connection is formed between the metal pad and one of a bond pad of the semiconductor chip or a package post of the integrated circuit package. In one embodiment, the metal pad is an aluminum pad and a metal line connects the metal pad to a bond pad of the semiconductor chip.
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Data Sheet for MIC2287 “1.2MHz PWM White LED Driver with OVP in 2mm×2mm MLF™ and Thin SOT-23,” pp. 1-10, Apr. 2004.
Alter Martin
Vinn Chuck
Cook Carmen C.
Kebede Brook
Kim Su C.
Micrel Inc.
Patent Law Group LLP
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