Saw and etch singulation method for a chip package

Details Saw and etch singulation method for a chip package Saw and etch singulation method for a chip package

2005-01-11

2005-01-11

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S112000, C438S113000

Reexamination Certificate

active

06841414

ABSTRACT:
A method of fabricating semiconductor packages from a lead frame strip which includes a mold cap applied to one side thereof, and defines a multiplicity of lead frames integrally connected to each other by connecting bars which extend in multiple rows and columns and define saw streets. In the singulation method of the present invention, the mold cap is sawed along the saw streets to expose the connecting bars. Thereafter, the connecting bars are chemically etched to separate the lead frames from each other.

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