Sealing apparatus for semiconductor wafer and method of...

Details Sealing apparatus for semiconductor wafer and method of... Sealing apparatus for semiconductor wafer and method of...

2006-09-19

2006-09-19

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C438S069000, C438S112000, C438S124000, C438S126000, C438S127000, C257S787000

Reexamination Certificate

active

07109057

ABSTRACT:
A sealing apparatus for a semiconductor wafer includes an upper mold and a lower mold. The lower mold includes a recess in which the semiconductor wader is placed, and a pot for introducing resin to the recess. The pot is located under a center area of the recess. Thus, when the resin is introduced in the recess, the resin is spread from the center area of the semiconductor wafer toward the peripheral area.

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