Self-aligned connector for stacked chip module

Details Self-aligned connector for stacked chip module Self-aligned connector for stacked chip module

1999-02-08

2000-02-29

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438598, 438622, 257686, H01L 2144, H01L 2148, H01L 2150, H01L 214763, H01L 2940

Patent

active

060308559

ABSTRACT:
A semiconductor structure includes a stack of two semiconductor chips. An edge of the chips forms a side surface of the stack. Insulation and adhesive is located between the chips, and a wire contacting circuitry on one of the chips extends through the insulation to the side surface. A first conductor contacts the wire on the side surface. The first conductor is self-aligned to the wire and extends above the side surface. The first conductor facilitates pads or connectors on the side surface that are insulated from the semiconductor chips. The self-aligned first conductor is an electroplated or electroless plated metal.

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patent: 5657537 (1997-08-01), Saia
patent: 5688721 (1997-11-01), Johnson

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