Self-adjusting semiconductor package stand-offs

Details Self-adjusting semiconductor package stand-offs Self-adjusting semiconductor package stand-offs

1997-09-19

1999-09-07

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438612, 257704, H01L 2144

Patent

active

059500735

ABSTRACT:
A semiconductor package structure that includes placing self-adjusting stand-offs between the substrate and sealband of the cap, such that the gap between the cap and the chip can be controlled, thereby improving the thermal and fatigue performance of the overall package. The height of the stand-off is varied by controlling the application (i.e., the temperature and the timing) of the heat that is used by the soldering process normally used in the generation of solder joints. The control of the soldering procedure is calibrated to optimize the amount of the stand-off which is dissolved, melted and spalled until the optimum height of the stand-off is reached.

REFERENCES:
patent: 5168344 (1992-12-01), Ehlert et al.
patent: 5471027 (1995-11-01), Call et al.
patent: 5641713 (1997-06-01), Kyle
patent: 5656551 (1997-08-01), Curbett et al.
patent: 5801074 (1998-09-01), Kim et al.
patent: 5821161 (1998-10-01), Covell, II et al.

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