Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-09-28
2011-12-13
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S584000, C257SE21499
Reexamination Certificate
active
08076178
ABSTRACT:
Embodiments of a method for assembling a multi-chip module (MCM) are described. During this method, a fluid that includes coupling elements is applied to a surface of a base plate in the MCM. Then, at least some of the coupling elements are positioned into negative features on the surface of the base plate using fluidic assembly. Note that a given coupling element selects a given negative feature using chemical-based selection and/or geometry-based selection. Next, the fluid and excess coupling elements (which reside in regions outside of the negative features on the surface) are removed.
REFERENCES:
patent: 7893531 (2011-02-01), Mitchell et al.
patent: 2004/0115696 (2004-06-01), Heller
patent: 2004/0157360 (2004-08-01), Gracias
patent: 2007/0075442 (2007-04-01), Krishnamoorthy et al.
patent: 2007/0194416 (2007-08-01), Vora
The Design of DNA Self-Assembled Computing Circuitry, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 12, No. 11, Nov. 2004, Chris Dwyer et al.
Computer-Aided Design for DNA Self-Assembly: Process and Applications, ICCAD-2005 International Conference on Computer Aided Design (IEEE Cat. No. 05CH37700), pp. 662-667, 2005, Chris Dwyer.
Heterogeneous Integration through Electrokinetic Migration, IEEE Engineering in Medicine and Biology, pp. 144-151, Nov./Dec. 2001, Mihrimah Ozkan et al.
Programmable Assembly at the Molecular Scale: Self-Assembly of DNA Lattices, Proceedings of the 2001 IEEE International Conference on Robotics & Automation, pp. 966-971, Seoul, Korea, May 21-26, 2001, John H. Reif et al.
Cunningham John E.
Krishnamoorthy Ashok V.
Mitchell James G.
Ghyka Alexander
Nikmanesh Seahvosh
Oracle America Inc.
Park Vaughan Fleming & Dowler LLP
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