Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2010-12-10
2011-11-29
Tran, Minh-Loan T (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S692000, C257S727000, C257SE23086, C257SE21506
Reexamination Certificate
active
08067273
ABSTRACT:
A semiconductor die package. The semiconductor die package includes a semiconductor die, and a lead comprising a flat surface. It also includes a clip structure including a (i) a contact portion, where the contact portion is coupled the semiconductor die, a clip aligner structure, where the clip aligner structure is cooperatively structured with the lead with the flat surface, and an intermediate portion coupling the contact portion and the clip aligner structure.
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Cruz Leslie Pilar
Fairchild Semiconductor Corporation
Kilpatrick Townsend & Stockton LLP
Tran Minh-Loan T
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