Self locking and aligning clip structure for semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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Details

C257S692000, C257S727000, C257SE23086, C257SE21506

Reexamination Certificate

active

08067273

ABSTRACT:
A semiconductor die package. The semiconductor die package includes a semiconductor die, and a lead comprising a flat surface. It also includes a clip structure including a (i) a contact portion, where the contact portion is coupled the semiconductor die, a clip aligner structure, where the clip aligner structure is cooperatively structured with the lead with the flat surface, and an intermediate portion coupling the contact portion and the clip aligner structure.

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