Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-09-12
2006-09-12
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S106000, C257SE23098, C257SE25013
Reexamination Certificate
active
07105382
ABSTRACT:
A device where the electrodes of an electroosmotic pump are located directly in the flow-producing region of the electroosmotic pump is described as well as methods of forming such a device. Placing the electrodes of an electroosmotic pump directly in the flow-producing region of the electroosmotic pump may increase the flow rate of a cooling fluid that is pumped through the pump. The cooling fluid may then remove a greater amount of heat from the substrate over which it is flowed. The substrate may be the non-device side of a die or a thermal management chip that is placed in direct contact with the non-device side of a die. In these instances the electroosmotic pump may be part of a microelectronic package containing the die or the thermal management chip.
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Kim Sarah E.
List R. Scott
Myers Alan M.
Blakely Sokoloff Taylor & Zaffman LLP
Mulpuri Savitri
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