Self-aligned electrodes contained within the trenches of an...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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C438S106000, C257SE23098, C257SE25013

Reexamination Certificate

active

07105382

ABSTRACT:
A device where the electrodes of an electroosmotic pump are located directly in the flow-producing region of the electroosmotic pump is described as well as methods of forming such a device. Placing the electrodes of an electroosmotic pump directly in the flow-producing region of the electroosmotic pump may increase the flow rate of a cooling fluid that is pumped through the pump. The cooling fluid may then remove a greater amount of heat from the substrate over which it is flowed. The substrate may be the non-device side of a die or a thermal management chip that is placed in direct contact with the non-device side of a die. In these instances the electroosmotic pump may be part of a microelectronic package containing the die or the thermal management chip.

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Laser, Daniel J., Electrokinetics and Electroosmotic Flow, The Electric Double Layer and Electrokinetic Effects, http://www.stanford.edu/˜dlaser/electrokinetics—and—eof/electrokinetics—and—eof.htm, research.htm, Jun. 2, 2003, 2 pages.
Laser, Daniel J., Silicon Electroosmotic Micropumps: Design and Theory of Operation, Prototypes, Performance, and Applications, Theory of Operation, http://www.stanford.edu/˜dlaser/silicon—eo—pumps/silicon—eo—pumps.htm, Jun. 2, 2003, 4 pages.
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