Semi-finished package and method for making a package

Details Semi-finished package and method for making a package Semi-finished package and method for making a package

2011-04-19

2011-04-19

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257S787000, C438S106000, C438S112000

Reexamination Certificate

active

07927924

ABSTRACT:
The present invention relates to a semi-finished package and a method for making a package. The semi-finished package includes a carrier and at least one molding compound. The molding compound is disposed on a surface of the carrier, and has a body and a plurality of outer protrusions. The outer protrusions are disposed at the periphery of the body, and the height of the outer protrusions is greater than that of the body. Thus, by utilizing the outer protrusions, the rigidity of the semi-finished package is increased, so as to overcome the warpage of the semi-finished package caused by different coefficients of thermal expansion of the molding compound and the carrier. Therefore, the yield rate of the package unit is increased.

REFERENCES:
patent: 6309909 (2001-10-01), Ohgiyama
patent: 6469932 (2002-10-01), Roohparvar et al.
patent: 2004/0029318 (2004-02-01), Kazama

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