Ultrathin chemically grown oxide film as a dopant diffusion...

Under bump metallization pad and solder bump connections

Under bump metallurgy structural design for high reliability...

Under-bump metallization layers and electroplated solder...

Undercut-free BLM process for Pb-free and Pb-reduced C4

Underfill process for flip-chip device

Underlayer film for copper, and a semiconductor device...

Underlayer liner for copper damascene in low k dielectric

Underlayer process for high O.sub.3 /TEOS interlayer dielectric

Underlayer protection for the dual damascene etching

Unidirectionally conductive materials for interconnection

Uniform contact

Uniform passivation method for conductive features

Uniform silicide metal on epitaxially grown source and drain...

Unique feature design enabling structural integrity for...

Unitary interconnection structures integral with a...

Unitary interconnection structures integral with a...

Unlanded via process

Unsymmetrical ligand sources, reduced symmetry...

Unsymmetrical ligand sources, reduced symmetry...