Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-03-31
2008-09-16
Lee, Calvin (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
07425500
ABSTRACT:
A method for fabricating a three-dimensional transistor is described. Atomic Layer Deposition of nickel, in one embodiment, is used to form a uniform silicide on all epitaxially grown source and drain regions, including those facing downwardly.
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Brask Justin K.
Chau Robert S.
Datta Suman
Doczy Mark L.
Kavalieros Jack T.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Lee Calvin
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