Uniform passivation method for conductive features

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S694000, C438S754000, C257S758000

Reexamination Certificate

active

07413976

ABSTRACT:
The top surfaces of conductive features are treated with a treatment solution before forming a passivation layer over the conductive features. The treatment solution includes a cleaning solution and a chemical grafting precursor. The treatment solution may also include a leveling and wetting agent to improve coverage uniformity of the chemical grafting precursor. The method results in a uniform passivation layer formed over conductive features across a surface of a workpiece.

REFERENCES:
patent: 6251710 (2001-06-01), Radens et al.
patent: 6277450 (2001-08-01), Katoot et al.
patent: 6774051 (2004-08-01), Chung et al.
patent: 2006/0141156 (2006-06-01), Viel et al.

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