Ultra low k plasma enhanced chemical vapor deposition...

Ultra thin TCS (SiCl4) cell nitride for DRAM capacitor with...

Ultra-thin resist coating quality by increasing surface...

Ultralow dielectric constant material as an intralevel or...

Ultralow dielectric constant material as an intralevel or...

Ultrasonic spray coating of liquid precursor for low K...

Ultrathin oxide films on semiconductors

Ultraviolet assisted porogen removal and/or curing processes...

Uniform dielectric film deposition on textured surfaces

Uniform nonconformal deposition for forming low dielectric const

Unique .alpha.-C:N:H/.alpha.-C:N.sub.x film liner/barrier to pre

Use of a biased precoat for reduced first wafer defects in...

Use of a plasma source to form a layer during the formation...

Use of cyclic siloxanes for hardness improvement of low k...

Use of enhanced turbomolecular pump for gapfill deposition...

Use of fluorine implantation to form a charge balanced...

Use of inductively-coupled plasma in plasma-enhanced...

Use of linear injectors to deposit uniform selective ozone...

Use of linear injectors to deposit uniform selective ozone...

Use of linear injectors to deposit uniform selective ozone...