LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Umos-like gate-controlled thyristor structure for ESD...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature

Uncooled amorphous YBaCuO thin film infrared detector

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature

Uncooled amorphous YBaCuO thin film infrared detector

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature

Uncooled ybacuo thin film infrared detector

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature

Uncooled YBaCuO thin film infrared detector

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Under bump metalization pad and solder bump connections

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

Under bump metallization layer to enable use of high tin...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Under bump metallization structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Under bump metallization structure of a semiconductor wafer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Under bump metallurgic layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

Under-ball-metallurgy layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Under-bond pad structures for integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Under-bump-metallurgy layer for improving adhesion

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Undercut-free BLM process for Pb-free and Pb-reduced C4

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Underfill and encapsulation of carrier substrate-mounted...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Underfill and encapsulation of carrier substrate-mounted...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Underfill and encapsulation of semiconductor assemblies with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Underfill and mold compounds including siloxane-based...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Underfill and mold compounds including siloxane-based...