Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-01-31
2006-01-31
Nguyen, Cuong (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S782000, C257S792000
Reexamination Certificate
active
06992398
ABSTRACT:
A method for underfilling and encapsulating flip-chip-configured semiconductor devices mounted on a carrier substrate using stereolithography (STL) to form, in situ, at least semisolid dam structures of photopolymeric material about the devices to entrap liquid, unpolymerized resin between the devices and substrate is disclosed. Prior to the STL process, the carrier substrate and mounted devices are immersed in the liquid polymeric resin, optionally with vibratory energy, to purge contaminants from between the device and substrate, and to fill spaces between the semiconductor devices and carrier substrate with the liquid resin.
REFERENCES:
patent: 3266125 (1966-08-01), Tobolski
patent: 4374080 (1983-02-01), Schroeder
patent: 4560138 (1985-12-01), De Puglia et al.
patent: 4712765 (1987-12-01), Sabet
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5407505 (1995-04-01), Groenwegen et al.
patent: 5484314 (1996-01-01), Farnworth
patent: 5665653 (1997-09-01), Bare et al.
patent: 5705117 (1998-01-01), O'Connor et al.
patent: 5851847 (1998-12-01), Yamanaka
patent: 5932254 (1999-08-01), Mitchell et al.
patent: 6179598 (2001-01-01), Brand
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6261501 (2001-07-01), Miyagawa et al.
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6291884 (2001-09-01), Glenn et al.
patent: 6325606 (2001-12-01), Brand
patent: 6326698 (2001-12-01), Akram
patent: 6344162 (2002-02-01), Miyajima
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6549821 (2003-04-01), Farnworth et al.
patent: 6607689 (2003-08-01), Farnworth
patent: 6613609 (2003-09-01), Laviron et al.
patent: 6833627 (2004-12-01), Farnworth
patent: 6875632 (2005-04-01), Farnworth
patent: 6881607 (2005-04-01), Farnworth
patent: 6893804 (2005-05-01), Farnworth et al.
patent: 2002/0171177 (2002-11-01), Kritchman et al.
patent: 2002/0195748 (2002-12-01), Farnworth
patent: 2003/0151167 (2003-08-01), Kritchman et al.
patent: 2003/0205849 (2003-11-01), Farnworth
Miller et al., “ Maskless Mesoscale Materials Deposition”, Deposition Technology, Sep. 2001, pp. 20-22.
Miller, “New Laser-Directed Deposition Technology”, Microelectronic Fabrication, Aug. 2001, p. 16.
Webpage Objet Prototyping the Future, “ Objet FullCure700 Series”, 1 page.
Webpage Objet Prototyping the Future, Objet Technology, “How it Works”, 2 pages.
Micro)n Technology, Inc.
Nguyen Cuong
TraskBritt
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