Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2004-06-14
2009-06-16
Soward, Ida M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S685000, C257S724000, C257S725000, C257S789000, C257S795000, C257S643000, C257S787000
Reexamination Certificate
active
07547978
ABSTRACT:
Polymerized materials for forming the underfill and encapsulation structures for semiconductor package are disclosed. A filler constituent, such as boron nitride, silicates, elemental metals, or alloys, may be added to a liquid photopolymer resin to tailor the physical properties thereof upon curing. The filler constituents may be employed to alter the coefficient of thermal expansion, thermal conductivity, or electrical conductivity of the polymerized material. A number of different embodiments are disclosed that employ the above materials in selected regions of the underfill and encapsulation structures of the semiconductor package. The polymerized materials may also be used to form support structures and covers for optically interactive semiconductor devices. Methods for forming the above structures using stereolithography are also disclosed.
REFERENCES:
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4463073 (1984-07-01), Miyauchi et al.
patent: 4575330 (1986-03-01), Hull
patent: 4925515 (1990-05-01), Yoshimura et al.
patent: 4929402 (1990-05-01), Hull
patent: 4996010 (1991-02-01), Modrek
patent: 4999143 (1991-03-01), Hull et al.
patent: 5015424 (1991-05-01), Smalley
patent: 5058988 (1991-10-01), Spence
patent: 5059021 (1991-10-01), Spence et al.
patent: 5059359 (1991-10-01), Hull et al.
patent: 5076974 (1991-12-01), Modrek et al.
patent: 5087964 (1992-02-01), Hatta
patent: 5096530 (1992-03-01), Cohen
patent: 5104592 (1992-04-01), Hull et al.
patent: 5123734 (1992-06-01), Spence et al.
patent: 5130064 (1992-07-01), Smalley et al.
patent: 5133987 (1992-07-01), Spence et al.
patent: 5141680 (1992-08-01), Almquist et al.
patent: 5143663 (1992-09-01), Leyden et al.
patent: 5164128 (1992-11-01), Modrek
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5174931 (1992-12-01), Almquist et al.
patent: 5174943 (1992-12-01), Hull
patent: 5182055 (1993-01-01), Allison et al.
patent: 5182056 (1993-01-01), Spence et al.
patent: 5182715 (1993-01-01), Vorgitch et al.
patent: 5184307 (1993-02-01), Hull et al.
patent: 5192469 (1993-03-01), Smalley et al.
patent: 5192559 (1993-03-01), Hull et al.
patent: 5209878 (1993-05-01), Smalley et al.
patent: 5234636 (1993-08-01), Hull et al.
patent: 5236637 (1993-08-01), Hull
patent: 5238639 (1993-08-01), Vinson et al.
patent: 5248456 (1993-09-01), Evans, Jr. et al.
patent: 5256340 (1993-10-01), Allison et al.
patent: 5258146 (1993-11-01), Almquist et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5267013 (1993-11-01), Spence
patent: 5273691 (1993-12-01), Hull et al.
patent: 5321622 (1994-06-01), Snead et al.
patent: 5344298 (1994-09-01), Hull
patent: 5345391 (1994-09-01), Hull et al.
patent: 5358673 (1994-10-01), Heller et al.
patent: 5378508 (1995-01-01), Castro et al.
patent: 5439622 (1995-08-01), Pennisi et al.
patent: 5447822 (1995-09-01), Hull et al.
patent: 5460703 (1995-10-01), Nulman et al.
patent: 5481470 (1996-01-01), Snead et al.
patent: 5495328 (1996-02-01), Spence et al.
patent: 5501824 (1996-03-01), Almquist et al.
patent: 5547906 (1996-08-01), Badehi
patent: 5554336 (1996-09-01), Hull
patent: 5555476 (1996-09-01), Suzuki et al.
patent: 5556590 (1996-09-01), Hull
patent: 5569349 (1996-10-01), Almquist et al.
patent: 5569431 (1996-10-01), Hull
patent: 5571471 (1996-11-01), Hull
patent: 5573722 (1996-11-01), Hull
patent: 5600181 (1997-02-01), Scott et al.
patent: 5609812 (1997-03-01), Childers et al.
patent: 5609813 (1997-03-01), Allison et al.
patent: 5610824 (1997-03-01), Vinson et al.
patent: 5622634 (1997-04-01), Noma et al.
patent: 5630981 (1997-05-01), Hull
patent: 5637169 (1997-06-01), Hull et al.
patent: 5651934 (1997-07-01), Almquist et al.
patent: 5659478 (1997-08-01), Pennisi et al.
patent: 5667820 (1997-09-01), Heller et al.
patent: 5672312 (1997-09-01), Almquist et al.
patent: 5675402 (1997-10-01), Cho et al.
patent: 5676904 (1997-10-01), Almquist et al.
patent: 5688464 (1997-11-01), Jacobs et al.
patent: 5693144 (1997-12-01), Jacobs et al.
patent: 5695707 (1997-12-01), Almquist et al.
patent: 5705016 (1998-01-01), Senoo et al.
patent: 5711911 (1998-01-01), Hull
patent: 5776409 (1998-07-01), Almquist et al.
patent: 5779967 (1998-07-01), Hull
patent: 5814265 (1998-09-01), Hull
patent: 5818005 (1998-10-01), Pratt et al.
patent: 5827394 (1998-10-01), Lu
patent: 5833869 (1998-11-01), Haas et al.
patent: 5854748 (1998-12-01), Snead et al.
patent: 5855718 (1999-01-01), Nguyen et al.
patent: 5855836 (1999-01-01), Leyden et al.
patent: 5869354 (1999-02-01), Leedy
patent: 5885511 (1999-03-01), Heller et al.
patent: 5897825 (1999-04-01), Fruth et al.
patent: 5902537 (1999-05-01), Almquist et al.
patent: 5902538 (1999-05-01), Kruger et al.
patent: 5904889 (1999-05-01), Serbin et al.
patent: 5933190 (1999-08-01), Dierickx et al.
patent: 5937265 (1999-08-01), Pratt et al.
patent: 5943235 (1999-08-01), Earl et al.
patent: 5945058 (1999-08-01), Manners et al.
patent: 5953590 (1999-09-01), Piper et al.
patent: 5969424 (1999-10-01), Matsuki et al.
patent: 5985523 (1999-11-01), Patton
patent: 5998867 (1999-12-01), Jensen et al.
patent: 6039830 (2000-03-01), Park et al.
patent: 6048948 (2000-04-01), Tochioka
patent: 6099783 (2000-08-01), Scranton et al.
patent: 6140151 (2000-10-01), Akram
patent: 6150240 (2000-11-01), Lee et al.
patent: 6245646 (2001-06-01), Roberts
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6266874 (2001-07-01), DiStefano et al.
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6283997 (2001-09-01), Garg et al.
patent: 6284072 (2001-09-01), Ryan et al.
patent: 6297138 (2001-10-01), Rimai et al.
patent: 6303469 (2001-10-01), Larson et al.
patent: 6307243 (2001-10-01), Rhodes
patent: 6322598 (2001-11-01), Meuris et al.
patent: 6323295 (2001-11-01), Muhlebach et al.
patent: 6323436 (2001-11-01), Hedrick et al.
patent: 6326698 (2001-12-01), Akram
patent: 6337122 (2002-01-01), Grigg et al.
patent: 6344402 (2002-02-01), Sekiya
patent: 6353257 (2002-03-01), Huang
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6399464 (2002-06-01), Muntifering et al.
patent: 6403168 (2002-06-01), Meyer et al.
patent: 6407334 (2002-06-01), Jimarez et al.
patent: 6417022 (2002-07-01), Hsiao et al.
patent: 6432752 (2002-08-01), Farnworth
patent: 6465329 (2002-10-01), Glenn
patent: 6468891 (2002-10-01), Williams
patent: 6471806 (2002-10-01), McKenna et al.
patent: 6472294 (2002-10-01), Meuris et al.
patent: 6482576 (2002-11-01), Farnworth et al.
patent: 6483719 (2002-11-01), Bachman
patent: 6498074 (2002-12-01), Siniaguine et al.
patent: 6500746 (2002-12-01), Williams
patent: 6509636 (2003-01-01), Tsai et al.
patent: 6514798 (2003-02-01), Farnworth
patent: 6518662 (2003-02-01), Smith et al.
patent: 6521844 (2003-02-01), Fuerniss et al.
patent: 6524346 (2003-02-01), Farnworth
patent: 6524881 (2003-02-01), Tandy et al.
patent: 6529027 (2003-03-01), Akram et al.
patent: 6537482 (2003-03-01), Farnworth
patent: 6544465 (2003-04-01), Farnworth et al.
patent: 6544821 (2003-04-01), Akram
patent: 6544902 (2003-04-01), Farnworth
patent: 6549821 (2003-04-01), Farnworth et al.
patent: 6551906 (2003-04-01), Oka
patent: 6562278 (2003-05-01), Farnworth et al.
patent: 6562661 (2003-05-01), Grigg
patent: 6569373 (2003-05-01), Napadensky
patent: 6569709 (2003-05-01), Derderian
patent: 6569753 (2003-05-01), Akram et al.
patent: 6582983 (2003-06-01), Runyon et al.
patent: 6585927 (2003-07-01), Grigg et al.
patent: 6593171 (2003-07-01), Farnworth
patent: 6607689 (2003-08-01), Farnworth
patent: 6611053 (2003-08-01), Akram
patent: 6632732 (2003-10-01), Williams
patent: 6644763 (2003-11-01), Gothait
patent: 6649991 (2003-11-01), Chen et al.
patent: 6658314 (2003-12-01), Gothait
patent: 6677238 (2004-01-01), Seki
patent: 6686225 (2004-02-01), Wachtler
patent: 6696363 (2004-02-01), Lee et al.
patent: 6696752 (2004-02-01), Su et al.
patent: 6713857 (2004-03-01), Tsai
patent: 6734032 (2004-05-01), Tandy et al.
patent: 6740962 (2004-05-01), Grigg
patent: 6746899 (2004-06-01), Grigg
patent: 6762502 (2004-07-01), Akram
patent: 6764933 (2004-07-01), Williams
patent: 6764935 (2004-07-01), Williams
patent: 6767815 (2004-07
Farnworth Warren M.
Hembree David R.
Micro)n Technology, Inc.
Soward Ida M
TraskBritt
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