Quad flat no-lead (QFN) grid array package, method of making...

Details Quad flat no-lead (QFN) grid array package, method of making... Quad flat no-lead (QFN) grid array package, method of making...

2007-10-09

2007-10-09

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

C257S676000, C257S690000, C257SE23031, C257SE23043, C361S772000, C361S813000, C438S111000, C438S123000

Reexamination Certificate

active

11215620

ABSTRACT:
A quad flat no-lead (QFN) grid array semiconductor package and method for making the same are provided. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on the semiconductor die is coupled to the plurality of conductive elements, such as by wire bonding. The semiconductor die and at least a portion of the lead frame are encapsulated in an insulative material, leaving the conductive elements exposed along a bottom major surface of the package for subsequent electrical connection with higher-level packaging. Individual conductive lead elements, as well as the grid array pattern, are formed by wire bonding multiple bond pads to a single lead at different locations and subsequently severing the leads between the bonding locations to form multiple conductive elements from each individual lead.

REFERENCES:
patent: 5286656 (1994-02-01), Keown et al.
patent: 5656550 (1997-08-01), Tsuji et al.
patent: 5714800 (1998-02-01), Thompson
patent: 5994784 (1999-11-01), Ahmad
patent: 6001671 (1999-12-01), Fjelstad
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6130473 (2000-10-01), Mostafazadeh et al.
patent: 6150709 (2000-11-01), Shin et al.
patent: 6177722 (2001-01-01), Kovats et al.
patent: 6184067 (2001-02-01), Casper
patent: 6190938 (2001-02-01), Liu
patent: 6198165 (2001-03-01), Yamaji et al.
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6255740 (2001-07-01), Tsuji et al.
patent: 6281047 (2001-08-01), Wu et al.
patent: 6284563 (2001-09-01), Fjelstad
patent: 6294830 (2001-09-01), Fjelstad
patent: 6342730 (2002-01-01), Jung et al.
patent: 6348726 (2002-02-01), Bayan et al.
patent: 6350668 (2002-02-01), Chakravorty
patent: 6372539 (2002-04-01), Bayan et al.
patent: 6399415 (2002-06-01), Bayan et al.
patent: 6400004 (2002-06-01), Fan et al.
patent: 6405359 (2002-06-01), Tseng et al.
patent: 6448633 (2002-09-01), Yee et al.
patent: 6451627 (2002-09-01), Coffman
patent: 6452255 (2002-09-01), Bayan et al.
patent: 6455348 (2002-09-01), Yamaguchi
patent: 6498099 (2002-12-01), McLellan et al.
patent: 6545347 (2003-04-01), McClellan
patent: 6585905 (2003-07-01), Fan et al.
patent: 6587892 (2003-07-01), Casper
patent: 6635957 (2003-10-01), Kwan et al.
patent: 6686652 (2004-02-01), Bayan et al.
patent: 6689640 (2004-02-01), Mostafazadeh
patent: 6700188 (2004-03-01), Lin
patent: 6777788 (2004-08-01), Wan et al.
patent: 6812552 (2004-11-01), Islam et al.
patent: 6967125 (2005-11-01), Fee et al.
patent: 2002/0125559 (2002-09-01), Mclellan
patent: 2000-243787 (2000-09-01), None
Australian Search Report dated Sep. 8, 2004 (4 pages).

Affiliated with

Also associated with

Rating

Quad flat no-lead (QFN) grid array package, method of making... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Quad flat no-lead (QFN) grid array package, method of making..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Quad flat no-lead (QFN) grid array package, method of making... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3824256