Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2007-03-30
2010-11-02
Tran, Minh-Loan T (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257SE23026, C257SE23033, C257SE23061
Reexamination Certificate
active
07825524
ABSTRACT:
A semiconductor system or sensor system in a housing which is butt-joined to a printed circuit board by soldering, at least some of the connecting surfaces not being soldered over their entire area, the connecting surfaces which are not soldered over their entire area being fixedly soldered in a first surface region to a section of a printed conductor, and in a second surface region the connecting surfaces not being fixedly connected to the printed circuit board, the securely soldered surface regions being situated closer to the semiconductor or sensor structure to be contacted than are the surface regions which are not fixedly connected to the printed circuit board.
REFERENCES:
patent: 5990545 (1999-11-01), Schueller et al.
patent: 6900551 (2005-05-01), Matsuzawa et al.
patent: 2001/0015481 (2001-08-01), Miyaki et al.
patent: 2002/0182776 (2002-12-01), Fujisawa et al.
patent: 2003/0001252 (2003-01-01), Ku et al.
patent: 2005/0093117 (2005-05-01), Masuda et al.
patent: 2005/0199987 (2005-09-01), Danno et al.
Doering Anton
Gahn Christoph
Haag Frieder
Mueller Stefan
Cruz Leslie Pilar
Kenyon & Kenyon LLP
Robert & Bosch GmbH
Tran Minh-Loan T
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