Quad flat package heat slug composition

Details Quad flat package heat slug composition Quad flat package heat slug composition

1995-01-12

1996-02-06

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257720, 257796, 361718, 174 524, H01L 23495, H01L 2328

Patent

active

054898013

ABSTRACT:
An integrated circuit package which contains a heat slug that extends from an integrated circuit to a top surface of a surrounding housing. The heat slug has a coefficient of thermal expansion that matches the coefficients of thermal expansion of the housing and the integrated circuit to reduce thermal stresses in the package.

REFERENCES:
patent: 5105259 (1992-04-01), McShane et al.
patent: 5172213 (1992-12-01), Zimmerman
patent: 5216283 (1993-06-01), Lin
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5291178 (1994-03-01), Strief et al.

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