Quad flat flip chip package and leadframe thereof

Details Quad flat flip chip package and leadframe thereof Quad flat flip chip package and leadframe thereof

2007-01-16

2007-01-16

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000

Reexamination Certificate

active

10904517

ABSTRACT:
A quad flat flip chip package and a leadframe therefor are provided. A bump connection part is defined by bending or etching the leads of the leadframe. Thus, the bump formed after a reflow process is limited within the bump connection part, and the collapse of the bump can be prevented. Moreover, and the manufacturing costs of the package can be decreased and the process thereof can be simplified.

REFERENCES:
patent: 6011300 (2000-01-01), Muramatsu
patent: 6864423 (2005-03-01), Tan et al.

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