QFN semiconductor package

Details QFN semiconductor package QFN semiconductor package

2010-07-21

2011-10-25

Dang, Phuc (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S673000, C257S684000, C438S123000, C438S126000

Reexamination Certificate

active

08044496

ABSTRACT:
A QFN semiconductor package includes a die attach pad; a semiconductor die mounted on the die attach pad; an inner terminal lead disposed adjacent to the die attach pad; a first wire bonding the inner terminal lead to the semiconductor die; an extended, outer terminal lead disposed along periphery of the QFN semiconductor package, wherein the extended, outer terminal lead is disposed beyond a maximum wire length which is provided for a specific minimum pad opening size on the semiconductor die; an intermediary terminal disposed between the inner terminal lead and the extended, outer terminal lead; a second wire bonding the intermediary terminal to the semiconductor die; and a trace interconnecting the intermediary terminal to the extended, outer terminal lead.

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patent: 2004/0178483 (2004-09-01), Hsu
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