QFN semiconductor package

Details QFN semiconductor package QFN semiconductor package

2010-07-21

2011-10-18

Dang, Phuc (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S673000, C257S684000, C438S123000, C438S126000

Reexamination Certificate

active

08039933

ABSTRACT:
A QFN semiconductor package includes a die attach pad; a semiconductor die mounted on the die attach pad; an inner terminal lead disposed adjacent to the die attach pad; a first wire bonding the inner terminal lead to the semiconductor die; an extended, outer terminal lead disposed along periphery of the QFN semiconductor package, wherein the extended, outer terminal lead is disposed beyond a maximum wire length which is provided for a specific minimum pad opening size on the semiconductor die; an intermediary terminal disposed between the inner terminal lead and the extended, outer terminal lead; a second wire bonding the intermediary terminal to the semiconductor die; and a third wire bonding the intermediary terminal to the extended, outer terminal lead.

REFERENCES:
patent: 6238952 (2001-05-01), Lin
patent: 6258893 (2001-07-01), Okayama
patent: 6261864 (2001-07-01), Jung
patent: 6306685 (2001-10-01), Liu
patent: 6333252 (2001-12-01), Jung
patent: 6342730 (2002-01-01), Jung
patent: 6495909 (2002-12-01), Jung
patent: 6507115 (2003-01-01), Hofstee et al.
patent: 6621140 (2003-09-01), Gibson
patent: 6642627 (2003-11-01), Song et al.
patent: 6700188 (2004-03-01), Lin
patent: 6861295 (2005-03-01), Jung
patent: 6906414 (2005-06-01), Zhao
patent: 7060535 (2006-06-01), Sirinorakul et al.
patent: 7307347 (2007-12-01), Yagi
patent: 7361984 (2008-04-01), Wu et al.
patent: 7471034 (2008-12-01), Schlote-Holubek
patent: 2004/0178483 (2004-09-01), Hsu
patent: 3167872 (1991-07-01), None

Affiliated with

Also associated with

Rating

QFN semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with QFN semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and QFN semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4260915