LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Packaging of integrated circuits and vertical integration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaging of integrated circuits with carbon nanotube arrays...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Packaging of MEMS devices using a thermoplastic

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Packaging of semiconductor chips with resin

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Packaging of semiconductor circuit in pre-molded plastic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Packaging of semiconductor device with a non-opaque cover

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Packaging of SMD light emitting diodes

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Packaging of SMD light emitting diodes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Packaging of solid state devices

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Packaging optically coupled integrated circuits using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials

Packaging process and structure of electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaging semiconductors at wafer level

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Packaging silicon on silicon multichip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Packaging stacked chips with finger structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Packaging structure and method of an image sensor module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Packaging structure for a hermetically sealed flip chip semicond

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Packaging structure for a solid-state imaging device with select

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging structure for ball grid array