Packaging stacked chips with finger structure

Details Packaging stacked chips with finger structure Packaging stacked chips with finger structure

2006-08-22

2006-08-22

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

Reexamination Certificate

active

07095091

ABSTRACT:
An improved finger structure applied to a packaging stack structure. The packaging stack structure is composed of several layers of chips, each chip is formed several leading wires and several finger sets are connected to the leading wire. Several finger units are formed on a finger set. The shape of these finger units is a strip structure with a bending angle, and the shape of these finger units is along an obverse direction of these leading wires to the finger unit and is changed corresponding to the obverse direction of the finger unit. The present invention can simplify the process and improve the reliability by changing the finger structure and continuously using the obverse bonding process to avoid the striking strength of the reverse bonding process.

REFERENCES:
patent: 6559526 (2003-05-01), Lee et al.
patent: 6680531 (2004-01-01), Hsu et al.

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