Packaging of solid state devices

Details Packaging of solid state devices Packaging of solid state devices

2006-01-03

2006-01-03

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S678000, C257S693000, C257S701000, C257S778000, C257S787000, C257S712000, C438S107000, C438S108000, C438S110000, C438S124000, C438S127000

Reexamination Certificate

active

06982482

ABSTRACT:
A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the solid state devices and an exterior of the package and matched coefficient of thermal expansion between the solid state devices and the materials used in packaging enables high power operation. The solid state devices are soldered between two layers of ceramic with metal traces that interconnect the devices and external contacts. This approach provides a simple method for assembling and encapsulating high power solid state devices.

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Canfield Technologies, Tech. Bull. No. 124 (2003).
Hitachi Chemical Co., “Epoxy Molding Compounds,” (2003).

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