Packaging optically coupled integrated circuits using...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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Details

C257S081000, C257S082000, C257S083000, C257S088000, C257S777000, C257S778000

Reexamination Certificate

active

06864509

ABSTRACT:
Packaging methods suitable for optically linking two silicon chips together for the purpose of optical isolation are shown. These packaging methods rely on the integration of Light Emitting Diodes (LEDs) onto one or both of the silicon chips as well as silicon light detectors. The packaging methods include optically linking of side by side silicon chips and vertically stacked chips.

REFERENCES:
patent: 4888625 (1989-12-01), Mueller
patent: 5654559 (1997-08-01), Spaeth et al.
patent: 6393183 (2002-05-01), Worley

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