Packaging structure

Details Packaging structure Packaging structure

2007-04-11

2009-12-29

Mandala, Victor (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S700000, C257SE23063

Reexamination Certificate

active

07638875

ABSTRACT:
A packaging structure including an interposer structure, a first electronic component, and a second electronic component is provided. The interposer structure includes a first dielectric layer, a plurality of contacts, a capacitive element, and an interconnection. The contacts are disposed on the upper and lower surfaces of the first dielectric layer and the capacitive element, which comprises two conductive layers and a second dielectric layer located among the layers, is embedded into the first dielectric layer. And the interconnection is embedded into the first dielectric layer, while the capacitive element electrically connects to the corresponding contacts through the interconnection. The first and the second electronic components are disposed respectively on the upper and bottom sides of the interposer structure and electrically connected to the corresponding contacts.

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