Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent
1997-10-20
2000-02-29
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
257723, 438106, 438121, H01L 2302
Patent
active
060312785
ABSTRACT:
An IC card, and manufacturing method thereof, are provided in which a pair of upper and lower metal panels are fixed to the top and bottom surfaces of a resin frame. Projections projecting upward or downward and having a given height are formed at a given distance from the outside edges of the frame. Cut-outs capable of fitting on the projections are provided on the metal panels, and the metal panels are assembled on the top and bottom surfaces of the frame with the cut-outs fitted on the corresponding projections. A portion of each projection is then deformed by pressing on the metal panels from above or below under a predetermined condition so that the metal panels are riveted to the frame.
REFERENCES:
patent: 5780365 (1998-07-01), Nogami
patent: 5867366 (1999-02-01), Klein
Ochi Katsunori
Ohbuchi Jun
Onoda Shigeo
Jr. Carl Whitehead
Mitsubishi Denki & Kabushiki Kaisha
Potter Roy
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