IC card and manufacturing method thereof

Details IC card and manufacturing method thereof IC card and manufacturing method thereof

1997-10-20

2000-02-29

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257723, 438106, 438121, H01L 2302

Patent

active

060312785

ABSTRACT:
An IC card, and manufacturing method thereof, are provided in which a pair of upper and lower metal panels are fixed to the top and bottom surfaces of a resin frame. Projections projecting upward or downward and having a given height are formed at a given distance from the outside edges of the frame. Cut-outs capable of fitting on the projections are provided on the metal panels, and the metal panels are assembled on the top and bottom surfaces of the frame with the cut-outs fitted on the corresponding projections. A portion of each projection is then deformed by pressing on the metal panels from above or below under a predetermined condition so that the metal panels are riveted to the frame.

REFERENCES:
patent: 5780365 (1998-07-01), Nogami
patent: 5867366 (1999-02-01), Klein

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