I/O pad structures for integrated circuit devices

Details I/O pad structures for integrated circuit devices I/O pad structures for integrated circuit devices

2011-03-01

2011-03-01

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE23015

Reexamination Certificate

active

07898088

ABSTRACT:
A semiconductor device, including methods and arrangements for making the same, are described. The device includes an integrated circuit die having a plurality of bond pads. At least one bond pad on the active surface of the die is an extended I/O pad. Each extended I/O pad extends to at least one peripheral side edge of the die.

REFERENCES:
patent: 4086375 (1978-04-01), LaChapelle et al.
patent: 5311405 (1994-05-01), Tribbey et al.
patent: 5384488 (1995-01-01), Golshan et al.
patent: 5783868 (1998-07-01), Galloway
patent: 6034438 (2000-03-01), Petersen
patent: 6060769 (2000-05-01), Wark
patent: 6420208 (2002-07-01), Pozder et al.
patent: 6727116 (2004-04-01), Poo et al.
patent: 6861742 (2005-03-01), Miyamoto et al.
patent: 6894386 (2005-05-01), Poo et al.
patent: 2005/0194682 (2005-09-01), Ohuchi et al.
patent: 2006/0186551 (2006-08-01), Lange et al.
U.S. Office Action dated Apr. 21, 2008 for U.S. Appl. No. 11/869,708.
U.S. Final Office Action dated Aug. 15, 2008 for U.S. Appl. No. 11/869,708.
U.S. Appl. No. 11/774,473 filed on Jul. 6, 2007.
“Redistributed Process,” http://www.flipchip.com/services/wafer—level/ultra—csp/redistributed—process.shtml, downloaded Dec. 13, 2007.
Notice of Allowance dated Oct. 3, 2008 from U.S. Appl. No. 11/869,708.

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