IC card

Details IC card IC card

2007-06-12

2007-06-12

Tran, Long K. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257S678000, C361S730000, C361S737000, C361S742000

Reexamination Certificate

active

11201380

ABSTRACT:
An IC card that has improved endurance and demonstrates increased resistance to cracking of the case and peeling of the substrate when a bending force acts upon the IC card. First protrusions and second protrusions are formed in a recess for fitting a LGA. The second protrusions are connected to the side wall of the recess on the card center side. Because the first protrusions maintaining a constant and correct gap between the bottom portion and LGA, that is, a constant and correct thickness of an adhesive, and the second protrusions are provided, the LGA and case can be reliably bonded together. The boundary portion with the thick portion of the recess on the card center side is a portion where stresses are easily concentrated and cracks can easily occur. However, because the second protrusions provided in the bottom portion of the recess are integrally connected to the side wall, the boundary portion is reinforced and stress concentration is relaxed. As a result, the occurrence of cracking from the boundary portion can be inhibited.

REFERENCES:
patent: 6304454 (2001-10-01), Akamatsu et al.
patent: 6988668 (2006-01-01), Osako et al.
patent: 2006/0220202 (2006-10-01), Osako et al.
patent: 2001-160125 (2001-06-01), None
patent: 2001-175835 (2001-06-01), None
patent: 2003-050980 (2003-02-01), None

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