IC card and manufacturing method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

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Details

235380, 235492, H05K 700, H05K 114

Patent

active

051842092

ABSTRACT:
An IC card including a circuit, electronic parts, and an I/O portion mounted on a circuit board integrally formed on a frame at its periphery. The circuit board, the circuit, and the electronic parts are hermetically sealed, except for a portion of the I/O portion, and the frame is filled with synthetic resin to a thickness no greater than that of the frame.

REFERENCES:
patent: 4004133 (1977-01-01), Hannan et al.
patent: 4550248 (1985-12-01), Hoppe et al.
patent: 4695925 (1987-09-01), Kodai et al.
patent: 4758689 (1988-07-01), Nakao et al.
patent: 4780791 (1988-10-01), Morita et al.
patent: 4822988 (1989-04-01), Gloton
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 4974120 (1990-11-01), Koddi et al.
patent: 4996441 (1991-02-01), Rebiock

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