LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Flip chip bump structure and method of making

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Flip chip C4 extension structure and process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Flip chip C4 extension structure and process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Flip chip carrier package with adapted landing pads

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Flip chip circuit arrangement with redistribution layer that min

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip design on a coplanar waveguide with a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Flip chip device having soldered metal posts by surface...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

Flip chip die

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip down-bond: method and apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Flip chip FET device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Flip chip FET device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor

Flip chip high power monolithic integrated circuit thermal bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Flip chip in leaded molded package with two dies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Flip chip integrated circuit packages accommodating exposed...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Flip chip integrated package mount support

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip chip interconnection pad layout