Flip chip bump structure and method of making

Details Flip chip bump structure and method of making Flip chip bump structure and method of making

1998-02-02

1999-11-02

Tran, Minh Loan

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257773, 257780, 257734, H01L 2348

Patent

active

059776323

ABSTRACT:
A passivation layer (16) is formed over a substrate (10) having an interconnect pad (12, 13). An opening in the passivation layer (16) exposes a portion of the interconnect pad (12, 13). A polyimide structure (18, 20) is formed adjacent to the opening in the passivation layer 16. Under bump metallurgy (22, 24) is formed over at least a portion of the polyimide structure (18, 20). A solder bump (28, 26) is formed over the Under bump metallurgy (22, 24).

REFERENCES:
patent: 5268026 (1993-12-01), Henry
patent: 5705855 (1998-01-01), Carson et al.
Lau, "Chip on Board Technologies For Multichip Modules", Chapman and Hall, NY, pp. 33-34, 72-73.

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