Flip chip integrated package mount support

Details Flip chip integrated package mount support Flip chip integrated package mount support

2005-11-08

2005-11-08

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

C257S787000, C257S778000, C257S774000, C257S773000, C257S788000, C257S686000

Reexamination Certificate

active

06963142

ABSTRACT:
A flip chip integrated package is described as including a chip encapsulated with a mold compound and mounted on a substrate. In one embodiment, the mold compound surrounds the chip, filling in space between the chip and the substrate. The substrate includes a plurality of openings through which the mold compound extrudes, forming molded buttons. In another embodiment, the substrate includes more numerous openings of a smaller diameter, which allow the mold compound to extrude through and create a molded rib. The molded buttons and the molded rib serve as a mount support feature. The substrate includes vents to allow trapped gas to be expelled from the package.

REFERENCES:
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5615089 (1997-03-01), Yoneda et al.
patent: 5981312 (1999-11-01), Farquhar et al.
patent: 6038136 (2000-03-01), Weber
patent: 6064114 (2000-05-01), Higgins, III
patent: 6075710 (2000-06-01), Lau
patent: 6143581 (2000-11-01), Johnson et al.
patent: 6210992 (2001-04-01), Tandy et al.
patent: 6229215 (2001-05-01), Egawa
patent: 6248959 (2001-06-01), Sylvester
patent: 6294825 (2001-09-01), Bolken et al.
patent: 6324069 (2001-11-01), Weber
patent: 6329220 (2001-12-01), Bolken et al.
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6365434 (2002-04-01), Rumsey et al.
patent: 6395579 (2002-05-01), Tandy et al.
patent: 6400574 (2002-06-01), Stephenson et al.
patent: 6417018 (2002-07-01), Bolken et al.
patent: 6444501 (2002-09-01), Bolken
patent: 6462273 (2002-10-01), Corisis et al.
patent: 6503781 (2003-01-01), Stephenson et al.
patent: 6518654 (2003-02-01), Bolken et al.
patent: 6521980 (2003-02-01), Tandy et al.
patent: 6531763 (2003-03-01), Bolken et al.
patent: 6537853 (2003-03-01), Johnson et al.
patent: 6559537 (2003-05-01), Bolken et al.
patent: 6573592 (2003-06-01), Bolken
patent: 6576496 (2003-06-01), Bolken et al.
patent: 6589820 (2003-07-01), Bolken
patent: 6605331 (2003-08-01), Johnson et al.
patent: 6638595 (2003-10-01), Rumsey et al.
patent: 6644949 (2003-11-01), Rumsey et al.
patent: 6653173 (2003-11-01), Bolken
patent: 6660558 (2003-12-01), Bolken et al.
patent: 6664139 (2003-12-01), Bolken
patent: 6677675 (2004-01-01), Bolken
patent: 6683388 (2004-01-01), Bolken
patent: 2001/0008780 (2001-07-01), Tandy et al.
patent: 2001/0045637 (2001-11-01), Farquhar et al.
patent: 2001/0046724 (2001-11-01), Stephenson et al.
patent: 2002/0000675 (2002-01-01), Rumsey et al.
patent: 2002/0001883 (2002-01-01), Rumsey et al.
patent: 2002/0016023 (2002-02-01), Bolken
patent: 2002/0048843 (2002-04-01), Bolken
patent: 2002/0050654 (2002-05-01), Bolken
patent: 2002/0052063 (2002-05-01), Bolken
patent: 2002/0096789 (2002-07-01), Bolken
patent: 2002/0100976 (2002-08-01), Hui et al.
patent: 2002/0105092 (2002-08-01), Coyle
patent: 2002/0131251 (2002-09-01), Corisis et al.
patent: 2002/0186549 (2002-12-01), Bolken
patent: 2003/0038381 (2003-02-01), Bolken

Affiliated with

Also associated with

Rating

Flip chip integrated package mount support does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip integrated package mount support, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip integrated package mount support will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3475027