Flip chip bump distribution on die

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

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257691, 257786, H01L 2352, H01L 2348

Patent

active

059527269

ABSTRACT:
An arrangement of bump pads for use on a face of a flip-chip semiconductor die. The arrangement comprises four corner regions, each corner region comprising multiple I/O bump pads and power bump pads. The corner regions are specialized bump arrangements depending upon the size of the die, signal to power ratios, and the core power requirements. The die arrangement also comprises multiple edge regions having multiple I/O bump pads and power bump pads. The edge regions are located along the edges of the die and are interleaved between the corner regions. The dimensions of the corner regions and the edge regions depend upon the power to signal ratio of the region. Also provided is a core power region having multiple power bump pads, centrally located within the edge regions and the corner groups. Core requirements mandating an odd number of rows and columns of bumps for the core require a special "checkerboard" arrangement also provided. Connections between the bumps and the edge of the die surface are shown. According to a second embodiment, there is provided a die surface arrangement with two power bumps, one live voltage, or power, bump and one ground bump, and multiple I/O bumps, all bumps linearly aligned, with the ground and power bumps both located intermediate between the I/O bumps. The ground, power, and I/O bumps form an array, and this array is replicated linearly across the die surface forming a linear array arrangement having alternately directed redistribution traces. The die surface arrangement comprises multiple linear array arrangements interspersed with multiple linearly aligned core power bumps.

REFERENCES:
patent: 3894860 (1975-10-01), Logue
patent: 4792532 (1988-12-01), Ohtani et al.
patent: 4860087 (1989-08-01), Matsubara et al.
patent: 5066831 (1991-11-01), Spielberger et al.
patent: 5153507 (1992-10-01), Fong et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5258648 (1993-11-01), Lin
patent: 5281151 (1994-01-01), Arima et al.
patent: 5341049 (1994-08-01), Shimizu et al.
patent: 5381307 (1995-01-01), Hertz et al.
patent: 5391917 (1995-02-01), Gilmour et al.
patent: 5422441 (1995-06-01), Iruka
patent: 5490040 (1996-02-01), Gaudenzi et al.
patent: 5510758 (1996-04-01), Fujita et al.
patent: 5523622 (1996-06-01), Harada et al.
patent: 5545923 (1996-08-01), Barber
patent: 5672911 (1997-09-01), Patil et al.
patent: 5686764 (1997-11-01), Fulcher
patent: 5703402 (1997-12-01), Chu et al.
A Low Cost Multichip Module Using Flex Substrate and Ball Grid Array, ICEMCM '96 Proceedings, pp. 28-32.
Electrical Characterization of the Interconnected Mesh Power System (IMPS) MCM Topology, IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, vol. 18, No. 1, Feb. 1995, pp. 99-105.
Design of the Interconnected Mesh Power System (IMPS) MCM Topology, MCM '94 Proceedings, pp. 543-548.
A Signal-Noise Comparison of the Interconnected Mesh Power System (IMPS) with a Standard Four-Layer MCM Topology, 1996, Michael D. Glover et al.
A Design Methodology for the Interconnected Mesh Power System (IMPS) MCM Technology, 1995 IEPS Conference, pp. 192-196.
Theory and Experimental Confirmation of the Interconnected Mesh Power System (IMPS) MCM Topology, The International Journal of Microcircuits and Electronic Packaging, vol. 18, No. 2, Second Quarter 1995 (ISSN 1063-1674), pp. 146-153.

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