Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2011-03-08
2011-03-08
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S734000, C257SE23010
Reexamination Certificate
active
07902666
ABSTRACT:
A disclosed semiconductor device having MPS-C2 (Metal Post Solder-Chip Connection) structure can be mounted on a PCB by an SMT mounter. A chip is disposed on a substrate. The substrate has a plurality of connecting pads and a plurality of accessory pads, and the chip has a plurality of corresponding metal posts and a plurality of accessory bumps. The dimensions on the soldered flat tops of the accessory bumps are corresponding to the soldered areas of the accessory pads where each soldered flat top has a plurality of angular corners and an edge between two adjacent angular corners where the length of the edge is twice greater than the pad pitch. Therefore, the displaced or rotational displaced metal posts can be pulled back and self-aligned during reflow processes so that an SMT mounter with poor alignment accuracy can be implemented for flip-chip bonding the semiconductor device having MPS-C2 structure to replace the conventional expensive flip-chip die bonder and to achieve higher productivity. Furthermore, the shape of the flat top surfaces of the metal posts does not have to match with the shape of the connecting pads.
REFERENCES:
patent: 6229220 (2001-05-01), Saitoh et al.
Hsu Hung-Hsin
Hsu Jui-Ching
Muncy Geissler Olds & Lowe, PLLC
Potter Roy K
Powertech Technology Inc.
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