Electronic assembly for image sensor device
Electronic assembly for removing heat from a flip chip
Electronic assembly having a more dense arrangement of...
Electronic assembly having a more dense arrangement of...
Electronic assembly having a multilayer adhesive structure
Electronic assembly having a wetting layer on a thermally...
Electronic assembly having an indium thermal couple
Electronic assembly having composite electronic contacts for...
Electronic assembly having electrically-isolated...
Electronic assembly having improved power supply bus voltage...
Electronic assembly having improved thermal characteristics
Electronic assembly having select spacing of rows and...
Electronic assembly having semiconductor component with...
Electronic assembly including a die having an integrated...
Electronic assembly including a die having an integrated...
Electronic assembly including a die having an integrated...
Electronic assembly including heat absorbing material for limiti
Electronic assembly including multiple substrates
Electronic assembly providing shunting of electrical current
Electronic assembly with first and second substrates