Electronic assembly having a multilayer adhesive structure

Details Electronic assembly having a multilayer adhesive structure Electronic assembly having a multilayer adhesive structure

2011-06-14

2011-06-14

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S734000, C257S748000

Reexamination Certificate

active

07960830

ABSTRACT:
An electronic assembly comprising a first substrate, a number of bonds on the first substrate, a second substrate spaced apart from the first substrate, a number of bumps on the second substrate, each of the bumps including an insulating body and a conductive portion, the conductive portion extending from a top surface of the insulating body via at least one sidewall of the insulating body toward the second substrate, and an adhesive between the first substrate and the second substrate, the adhesive including an insulating layer and a conductive layer, the insulating layer and the conductive layer being laminated with respect to each other, wherein the insulating layer is positioned closer to the first substrate than the conductive layer.

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Office Action from related U.S. Appl. No. 12/237,578, mailed Jul. 16, 2010.

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